Copper Nanoparticle Ink CI-006
Product Introduction
Equipment Parameters
Specification: 100g
CI-006 is formulated for polyimide (PI) and polyethylene terephthalate (PET) substrates. It is a high-performance conductive ink based on copper nanoparticles dispersed in glycol ethers, featuring aerosol pneumatic atomization. On PI and on PET in a formic acid atmosphere, it exhibits both photonic sinterability and solderability. CI-006 requires laser curing under a reducing atmosphere or in the presence of formic acid vapor.
Parameters
| Description | Spherical Copper Ink in Ethanol Solvent |
| Viscosity | 30-40cp |
| Curing temperature | 250°C |
| Resistivity | 3.4E-6 to 7.7E-6 (Ω-cm) |
| Average particle size | D50 90nm |
| Silver content (solid content) | 60 wt% |
| Nebulizer | Pneumatic atomizer |
| Base material | PET and polyimide |
Performance
Treatment with PulseForge, laser, or formic acid vapor
Download Materials
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