Product Introduction

Equipment Parameters

Specification: 50g

ANI’s Al-IS1000 is an aluminum ink designed for non-contact printing technologies such as spray and atomized jet printing, specifically tailored for conductive applications in the silicon photovoltaic industry. Al-IS1000 is formulated for spray deposition and thermal curing, enabling the formation of conductive patterns on silicon substrates. Its small particle size facilitates non-contact applications—including spraying and direct printing—and ensures compatibility with next-generation thin (180 μm) silicon wafer technology. This aluminum ink contains no glass frits and employs a proprietary polymer to achieve passivation-layer diffusion. The aluminum ink is specially engineered for photovoltaic applications on silicon wafers, delivering low contact resistance and high resistivity for silicon. In addition, Al-IS1000 forms a highly uniform back-surface-field (BSF) layer. Notably, Al-IS1000 is free of lead and cadmium.

 

Parameters

Description Aluminum ink
Viscosity 80-120cP
Chip resistor <10 mΩ/sq
Dry layer thickness 10–30 μm
Back Surface Field Thickness (BSF) up to 10 μm
Bending (160 μm wafer) <1mm
Nebulizer Pneumatic atomizer
Base material PI, ceramics, silicon wafers


Keywords


Download Materials

Ink Consumables Manual

The materials used in the equipment are fully open-source; you can either purchase materials from established commercial brands or formulate your own. For more details, please contact your local distributor.

Software size:

596.4KB

File type:

pdf

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