AL ink
Product Introduction
Equipment Parameters
Specification: 50g
ANI’s Al-IS1000 is an aluminum ink designed for non-contact printing technologies, such as spray and atomization jet printing, and is suitable for conductive applications in the silicon photovoltaic industry. Al-IS1000 is applied via inkjet and thermally cured to form conductive patterns on silicon substrates. Its small particle size enables non-contact deposition methods, including spraying and direct printing, and is compatible with next-generation thin (180 μm) silicon wafer technology. This aluminum ink contains no glass frits and employs a proprietary polymer to achieve passivation-layer diffusion. The aluminum ink is specifically engineered for photovoltaic applications on silicon wafers, offering low electrical contact resistance on silicon. Furthermore, Al-IS1000 forms a highly uniform back-surface field (BSF) layer. Notably, Al-IS1000 is free of lead and cadmium.
Parameter
| Description | Aluminum ink |
| Viscosity | 80-120cP |
| Chip resistor | <10 mΩ/sq |
| Dry, layer upon layer thick | 10–30 μm |
| Back-Surface Field Thickness (BSF) | up to 10 μm |
| Bending (160 μm wafer) | <1mm |
| Nebulizer | Pneumatic atomizer |
| Base material | PI, ceramics, silicon wafers |
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