Product Introduction

Equipment Parameters

Specification: 100 mL

It overcomes the insufficient aspect ratio inherent in conventional photoresists used in UV lithography, exhibiting very low light absorption in the near-UV range (365–400 nm) and ensuring uniform exposure across the entire resist layer, thereby enabling the formation of thick-film patterns with vertical sidewalls and high aspect ratios. Moreover, it boasts excellent mechanical properties, chemical resistance, and thermal stability: upon exposure to UV radiation, it undergoes cross-linking, functioning as a chemically amplified negative-tone resist that can pattern complex structures such as stepped features; during electroplating, it can be directly employed as an insulating layer.

The SU-8 3005 series of photoresists are negative-tone resists formulated with cyclopentanone as the solvent. In ultra-thick-film coating processes, they deliver excellent pattern stability and high resolution. Moreover, their film-thickness range is broader than that of any other commercially available photoresist: a single spin-coating step can produce films ranging from 0.5 to 300 μm in thickness, and multiple spin-coatings can be performed as needed to achieve even thicker films.

 

Parameters

SU-8 3005 Single Spin-Coating Film Thickness Range 6-10um
Pneumatic atomizer Nebulizer
PI, glass Base material


Keywords


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Ink Consumables Manual

The materials used in the equipment are fully open-source; you can either purchase materials from established commercial brands or formulate your own. For more details, please contact your local distributor.

Software size:

596.4KB

File type:

pdf

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