Flex A532
Micro- and nano-scale molding
Dual-material compatibility
Empowering Scientific Research and Precision Manufacturing
Professional-grade, high-precision photopolymerization 3D printer
It simultaneously supports high-precision printing of both microfluidic resins and ceramic materials.
Specifically designed for microfluidic chips and precision forming of ceramic materials.
Empowering biomedicine, scientific research innovation, and high-end manufacturing.
Product Introduction
(1) Micro- and Nano-Scale Photocuring Additive Manufacturing Technology
- 405 nm UV LED light source
- 25 μm exposure accuracy
- Adjustable layer thickness of 5–60 μm
- Enables precision fabrication of microfluidic channels, microstructured arrays, and other intricate features, catering to a wide range of research and manufacturing applications.
(2) Proprietary Intelligent Slicing System
With proprietary intellectual property, it supports custom printing strategies, integrates real-time slicing preview, reduces R&D trial-and-error and product prototyping costs, and accommodates dual-material printing requirements.
(3) Closed-loop quality control design
Equipped with 3D microscopic measurement capabilities, it ensures print‑out structural consistency and repeatability, thereby guaranteeing the reliability of research data and meeting product‑level precision requirements.
(4) Compatible Material System
- Microfluidic‑specific resins: transparent/semi‑transparent resins (for visual observation), biocompatible resins, and highly elastic soft resins (designed to meet diverse research and manufacturing needs).
- Ceramics and composite materials: zirconia, alumina ceramic slurries (for high‑temperature/high‑pressure applications), metal pastes (to expand application horizons), and functionalized ceramic materials.
(5) Core Product Advantages
- Dual-material compatibility: One single device supports both microfluidic resin and ceramic printing, meeting the diverse needs of research and precision manufacturing—no additional equipment required.
- Micro‑ and nano‑scale precision: 25 μm exposure accuracy, supporting cutting‑edge research experiments and the prototyping of precision products at the micro‑ and nanoscale.
- End-to-end controllability: Closed-loop quality control ensures reproducibility of research data, consistent product structure, and compliance with precision standards.
- Customized Adaptation: Proprietary software combined with open APIs, enabling tailored solutions to meet specific requirements.
(6) Application Industries and Scenarios
1) Applications in the field of scientific research
- Research on micro- and nanoscale flows and interfacial flows
- Research on fluid–structure interaction and material properties
- Development of novel materials and biophysics-related research
2) Industrial and Medical Extended Applications
- Biomedical: Microfluidic biochips, precision components for medical devices
- Precision Manufacturing: Prototyping of MEMS, Sensors, and Precision Ceramic Components
- Research and Education: University laboratory research projects and experimental teaching
Equipment Parameters
Model number
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Flex A532
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Light source
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Ultraviolet LED (405 nm)
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Exposure accuracy
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25 microns (Core Parameters of Micro/Nano Molding)
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Print layer thickness
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5–60 micrometers (Adjustable, compatible with diverse structures)
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Maximum machining size
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50 mm×30 mm×20 mm (suitable for research samples and small precision parts)
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Slicing software
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In-house development, with support for custom features.
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Accessibility
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Real-time slice preview and 3D microscopic measurement
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Download Materials
Model: Flex C762 Light Source: UV LED (405 nm) Exposure Resolution: 12 µm (key parameter for micro‑ and nano‑fabrication) Layer Thickness: 5–40 µm (adjustable, suitable for multi‑material structures) Maximum Build Volume: 70 mm × 60 mm × 20 mm (ideal for research samples and small precision parts) Slicing Software: Proprietary, with customizable features; includes real-time slicing preview and 3D microscopic measurement.
Model: Flex C831 Light Source: UV LED (405 nm) Exposure Accuracy: 10 µm (key parameter for micro‑ and nano‑fabrication) Layer Thickness: 5–40 µm (adjustable, suitable for diverse structures) Maximum Build Volume: 80 mm × 30 mm × 10 mm (ideal for research samples and small precision parts) Slicing Software: Proprietary, with customizable features; includes real-time slicing preview and 3D microscopic measurement.
Model: Flex Y632 Light Source: UV LED (405 nm) Exposure Resolution: 2.0 µm (key parameter for micro‑ and nano‑fabrication) Layer Thickness: 5–20 µm (adjustable, suitable for diverse structures) Maximum Build Volume: 60 mm × 30 mm × 20 mm (ideal for research samples and small precision parts) Slicing Software: In‑house developed, with customizable features; includes real-time slicing preview and 3D microscopic measurement capabilities.
With the advancement of technology, electronic devices are increasingly demanding lightweight, efficient, and customizable energy-storage solutions. From smartwatches to drones, and from wearable gadgets to intelligent sensors, the “miniaturization” of energy storage has become a key focus in scientific research and development. Among numerous emerging materials, MXene has emerged as a rising star, thanks to its exceptional electrical conductivity, high capacitance, and tunable properties. Nevertheless, effectively, stably, and precisely integrating MXene into micrometer-scale manufacturing processes remains a significant challenge. A recent study published in Small Methods has achieved a breakthrough by developing a stable Ti₃C₂Tₓ MXene ink formulation. Combined with aerosol jet printing (AJP), this approach enables the fabrication of high-resolution, high-performance micro-supercapacitors, opening up new possibilities for fields such as microelectronics and energy storage.
When you casually discard an electronic sensor, you may not realize that it could persist in the soil for centuries, becoming “electronic waste” that pollutes the environment. Today, the global Internet of Things is experiencing explosive growth: by 2025, more than 30 billion devices are expected to be deployed, bringing with them tens of millions of tons of electronic waste annually and depleting critical mineral resources. However, a groundbreaking study published in npj Advanced Manufacturing has opened new avenues for eco‑friendly electronics: a research team from Northwestern University and other institutions has successfully developed fully biodegradable printed electronic sensors using aerosol jet printing. From the substrate to the ink, everything is derived entirely from biomass, delivering exceptional performance while naturally breaking down at the end of its lifecycle—truly embodying the principle of “from nature, back to nature.”
With the rapid advancement of microelectronic devices and wearable technologies, on-chip energy storage components must balance high energy density with compact form factors. Micro-supercapacitors (MSCs) have emerged as a leading candidate; however, conventional planar electrode architectures suffer from low active-material loading and long ion‑transport pathways. Two-dimensional Ti₃C₂Tₓ MXene materials, with their high specific surface area and excellent electrochemical performance, are an ideal choice for fabricating high‑performance MSCs. Nevertheless, their 3D assembly faces three major challenges: first, MXene nanosheets are held together only by weak van der Waals forces and hydrogen bonds, lacking strong interfacial interactions and thus failing to maintain a stable 3D architecture; second, existing methods rely on binders and other additives, which can occupy active sites and degrade device performance; third, traditional 3D‑printing techniques exhibit low resolution (typically >40 μm) and low aspect ratios (generally <0.3), making it difficult to fabricate high‑fidelity, complex 3D microstructures. To address these bottlenecks, a team at Carnegie Mellon University has developed an additive‑free aerosol jet printing (AJP) technique that enables the 3D self‑supporting assembly of MXene nanosheets. The resulting work was published in the journal Small.
Researchers at Carnegie Mellon University pioneered the CMU Array.
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Beijing Yunshang Intelligent Manufacturing Technology Co., Ltd.
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Headquarters Address: Room 708, Building 2, HICOOL Industrial Park, Nanfaxin, Shunyi District, Beijing
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